JPH0286142U - - Google Patents
Info
- Publication number
- JPH0286142U JPH0286142U JP16649388U JP16649388U JPH0286142U JP H0286142 U JPH0286142 U JP H0286142U JP 16649388 U JP16649388 U JP 16649388U JP 16649388 U JP16649388 U JP 16649388U JP H0286142 U JPH0286142 U JP H0286142U
- Authority
- JP
- Japan
- Prior art keywords
- notch
- resin
- package
- semiconductor device
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000007789 sealing Methods 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000002699 waste material Substances 0.000 description 5
- 238000004080 punching Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16649388U JPH071800Y2 (ja) | 1988-12-23 | 1988-12-23 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16649388U JPH071800Y2 (ja) | 1988-12-23 | 1988-12-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0286142U true JPH0286142U (en]) | 1990-07-09 |
| JPH071800Y2 JPH071800Y2 (ja) | 1995-01-18 |
Family
ID=31453923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16649388U Expired - Lifetime JPH071800Y2 (ja) | 1988-12-23 | 1988-12-23 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH071800Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014207261A (ja) * | 2013-04-10 | 2014-10-30 | 株式会社デンソー | 半導体装置及びその製造方法 |
-
1988
- 1988-12-23 JP JP16649388U patent/JPH071800Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014207261A (ja) * | 2013-04-10 | 2014-10-30 | 株式会社デンソー | 半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH071800Y2 (ja) | 1995-01-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |